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AIT Die Bonder is a full-automatic chip mounting device equipped with an automatic wafer processing system, which can process wafers of various specifications, and is stable, fast, and accurate. It also supports flip chip and stacking processes
AIT Die Bond equipment isRhea 2020 is equipped with fast and reliable linear motor and precise motion fitting head,
Provide stable and reliable fitting pressure with good fitting performance.
Application area
Chip bonding
Technical parameter
High precision: XY position ± 10 | imQ3. Rotation accuracy ± 0.2 ° @ 3
High efficiency: UPHN2200
Compatibility: It can handle 12 inch wafers and 8 inch wafers
Fully automatic: from feeding, dispensing, wafer searching, bonding and guide detection, fully automatic operation can be achieved, supporting Carrier Board, lead frame and Magazine to Magazine H type carrier plate feeding
